Purpose of the position
Foxconn Technology Group, a globally leading electronics manufacturing company, is now hiring a SMT Process Experiment Engineer.
Lead reliability test analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as cross secion/Dye&pry/shear/pull/torsion/FT-IR etc.
Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using SEM/EDS and optical microscopy, data support for process optimization and quality improvement and collaborate with DFM teams to improve designs based on failure mode data.  
Develop test methodologies for new materials (low temperature solders, Flex PCBs).    

Duties and Responsibilities             
1. Lead SMT reliability test and analysis: such as cross-section, Dye&pry, shearpulltorsion, FT-IR etc.
2. Preparation SMT reliability test report   
3. Maintenance experimental equipment
4. Manage and training operation technicians  
5. Optimize reliability test processes and methods to improve efficiency and accuracy
6. Lead Line-qualification of SMT lines and progress tracking

Education and work experience
Educational Requirements: Bachelor's degree or above
Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply.

Working conditions

1. Join a high-growth, innovation-driven team shaping next-gen consumer electronics.
2. Work at the intersection of engineering, automation, and global operations.
3. Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.